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agilent hfbr-779b/be and hfbr- 789b/be pluggable parallel fiber optic modules, transmitter and receiver data sheet description the hfbr-779b transmitter and HFBR-789B receiver are high performance fiber optic modules for parallel optical data communication applications. these 12-channel devices, operating up to 2.7 gbd per channel, provide a cost effective solution for short-reach applications requiring up to 32 gb/s aggregate bandwidth. these modules are designed to operate on multimode fiber systems at a nominal wavelength of 850 nm. they incorporate high perfor mance, highly reliable, short wavelength optical devices coupled with proven circuit technology to provide long life and consistent service. the hfbr-779b transmitter module incorporates a 12- channel vcsel (vertical cavity surface emitting laser) array together with a custom 12- channel laser driver integrated circuit providing iec-60825 and cdrh class 1m laser eye safety. the HFBR-789B receiver module contains a 12-channel pin photodiode array coupled with a custom preamp lifier / post am plifier integrated circuit. operating from a single +3.3 v power supply, both modules provide lvttl or lvcmos control interfaces and current mode logic (cml) compatible data interfaces to simplify external circuitry. the transmitter and receiver devices are housed in mtp?/ mpo receptacled packages. electrical connections to the devices are achieved by means of a pluggable 10 x 10 connector array. ordering information the hfbr-779b and hfbr- 789b products are available for production orders through the agilent component field sales office. hfbr-779b no emi nose shield HFBR-789B no emi nose shield hfbr-779be with extended emi nose shield HFBR-789Be with extended emi nose shield features ? low cost per gb/s ? high package density per gb/s ? 3.3 volt power supply for low power consumption ? 850 nm vcsel array source ? 12 independent channels per module ? separate transmitter and receiver modules ? 2.7 gbd data rate per channel ? standard mtp? (mpo) ribbon fiber connector interface ? pluggable package ? 62.5/125 micron multimode fiber operation: distance up to 100 m with 160 mhz.km fiber at 2.5 gbd distance up to 200 m with 400 mhz.km fiber at 2.5 gbd ? data i/o is cml compatible ? control i/o is lvttl compatible ? manufactured in an iso 9002 certified facility applications ? datacom switch and router backplane connections ? telecom switch and router backplane connections ? infiniband connections
2 design summary: design for low-cost, high-volume manufacturing agilents parallel optics solution combines twelve 2.7 gbd channels into discrete transmitter and receiver modules providing a maximum aggregate data rate of 32 gb/s. moreover, these modules employ a heat sink for thermal management when used on high-density cards, have excellent emi performance, and interface with the industry standard mtp?/mpo connector systems. they provide the most cost-effective high- density (gbd per inch) solutions for high-data capacity applications. see figure 1 for the transmitter and figure 2 for the receiver block diagrams. the hfbr-779b transmitter and the HFBR-789B receiver modules provide very closely spaced, highspeed parallel data channels. within these modules there will be some level of cross talk between channels. the cross talk within the modules will be exhibited as additional data jitter or sensitivity reduction compared to single-channel performance. agilent technologies jitter and sensitivity specifications include cross talk penalties and thus represent real, achievable module performance. functional description, transmitter section the transmitter section, figure 1, uses a 12-channel 850 nm vcsel array as the optical source and a diffractive optical lens array to launch the beam of light into the fiber. the package and connector system are designed to allow repeatable coupling into standard 12-fiber ribbon cable. in addition, this module has been designed to be compliant with iec 60825 class 1 eye safety requirements. the optical output is controlled by a custom ic, which provides proper laser drive parameters and monitors drive current to ensure eye safety. an eeprom and state machine are programmed to provide both ac and dc current drive to the laser to ensure correct modulation, eye diagram and extinction ratio over variations of temperature and power supply voltages. functional description, receiver section the receiver section, figure 2, contains a 12-channel algaas/ gaas photodetector array, transimpedence preamplifier, filter, gain stages to amplify and buffer the signal, and a quantizer to shape the signal. the signal detect function is designed to sense the proper optical output signal on each of the 12 channels. if loss of signal is detected on an individual channel, that channel output is squelched. packaging the flexible electronic subassembly was designed to allow high-volume assembly and test of the vcsel, pin photo diode and supporting electronics prior to final assembly. regulatory compliance the overall equipment design into which the parallel optics module is mounted will determine the certification level. the module performance is offered as a figure of merit to assist the designer in considering their use in the equipment design. organization recognition see the regulatory compliance table for a listing of the standards, standards associations and testing laboratories applicable to this product. electrostatic discharge (esd) there are two design cases in which immunity to esd damage is important. the first case is during handling of the module prior to mounting it on the circuit board. it is im portant to use normal esd handling precautions for esd sen sitive devices. these precautions include using grounded wrist straps, work benches, and floor mats in esd controlled areas. the second case to consider is static discharges to the exterior of the equipment chassis containing the module parts. to the extent that the mtp? (mto) conn ector receptacle is exposed to the outside of the equipment cha ssis it may be subject to system level esd test criteria that the equipment is intended to meet. see the regulatory compliance table for further details.
3 figure 1. transmitter block diagram. * tx_en, tx_dis, reset-, fault- figure 2. receiver block diagram (each channel). d/a converter input stage level shifter driver amplifier comparator temperature detection circuit d/a converter controller 12 vcsel array din+ din- serial control i/o* 4 shut down 12 12 signal detect circuit limiting amplifier output buffer data out data out sd trans- impedance pre- amplifier offset contr ol
4 electromagnetic interference (emi) many equipment designs using these high-data-rate modules will be required to meet the requirements of the fcc in the united states, cenelec in europe and vcci in japan. these modules, with their shielded design, perform to the levels detailed in the regulatory compliance table. the performance detailed in the regulatory compliance table is intended to assist the equipment desi gner in the management of the overall equipment emi perfor mance. however, system margins are dependent on the cust omer board and chassis design. immunity equipment using these modules will be subject to radio frequency electromagnetic fields in some environments. these modules have good immunity due to their shielded designs. see the regulatory compliance table for further detail. eye safety these 850 nm vcsel-based modules provide eye safety by design. the hfbr-779b has been registered with cdrh and certified by tuv as a class 1m device under amendment 2 of iec 60825-1. see the regulatory compliance table for further detail. if class 1m exposure is possible, a safety- warning label should be placed on the product stating the following: laser radiation do not view directly with optical instruments class 1m laser product connector cleaning the optical connector used is the mtp? (mpo). the optical ports have recessed optics that are visible through the nose of the ports. the provided port plug should be installed any time a fiber cable is not connected. the port plug ensures the optics remain clean and no cleaning should be necessary. in the event the optics become contaminated, forced nitrogen or clean dry air at less than 20 psi is the recommended cleaning agent. the optical port features, including guide pins, preclude use of any solid instrument. liquids are not advised due to potential damage. process plug each parallel optics module is supplied with an inserted process plug for protection of the optical ports within the mtp? (mto) conn ector receptacle. handling precautions the hfbr-779b and hfbr- 789b can be damaged by current surges and over-voltage conditions. power supply transient precautions should be taken. normal handling precautions for electrostatic sensitive devices should be taken (see esd section). the hfbr-779b is a class 1m laser product. do not view radiation directly with optical instruments.
5 absolute maximum ratings [1,2] notes: 1. absolute maximum ratings are those values beyond which damage to the device may occur. see reliability data sheet for specifi c reliability performance. 2. between absolute maximum ratings and the recommended operating conditions functional performance is not intended, device reli ability is not implied, and damage to the device may occur over an extended period of time. 3. this is the maximum voltage that can be applied across the transmitter differential data inputs without damaging the input ci rcuit. 4. case temperature is measured as indicated in figure 3. recommended operating conditions [1] notes: 1. recommended operating conditions are those values outside of which functional performance is not intended, device reliability is not implied, and damage to the device may occur over an extended period of time. see reliability data sheet for specific reliability performance . 2. case temperature is measured as indicated in figure 3. a 55c, 1 m/s, parallel to the printed circuit board, air flow at the module or equivalent cooling is required. see figure 4. 3. the receiver has a lower cut off frequency near 100 khz. 4. data inputs are cml compatible. coupling capacitors are required to block dc. ? v dinp-p = ? v dinh ? ? v dinl , where ? v dinh = high state differential data input voltage and ? v dinl = low state differential data input voltage. 5. power supply noise is defined for the supply, vcc, over the frequency range from 500 hz to 2500 mhz, with the recommended pow er supply filter in place, at the supply side of the recommended filter. see figures 5 and 6 for recommended power supply filters. parameter symbol min. max. unit reference storage temperature (non-operating) t s ?40 100 c 1 case temperature (operating) t c 90 c 1, 2, 4 supply voltage v cc ?0.5 4.6 v 1, 2 data/control signal input voltage v i ?0.5 v cc + 0.5 v 1 transmitter differential data input voltage |v d |2v1, 3 output current (dc) i d 25 ma 1 relative humidity (non-condensing) rh 5 95 % 1 parameter symbol min. typ. max. unit reference case temperature t c 04080c2, figs. 3, 4 supply voltage v cc 3.135 3.3 3.465 v figs. 5, 6, 12 signaling rate per channel 1 2.72 gbd 3 data input differential peak-to-peak voltage swing d v dinp-p 175 1400 mv p-p 4, figs. 7, 8 control input voltage high v ih 2.0 v cc v control input voltage low v il v ee 0.8 v power supply noise for transmitter and receiver n p 200 mv p-p 5, figs. 5, 6 transmitter/receiver data i/o coupling capacitors c ac 0.1 f fig. 7 receiver differential data output load r dl 100 w fig. 7
6 electrical characteristics transmitter electrical characteristics (t c = 0 c to +80 c, v cc = 3.3 v 5%, typical t c = +40 c, v cc = 3.3 v) parameter symbol min. typ. max. unit reference (conditions) supply current i cct 320 415 ma fig. 6 power dissipation p dist 1.1 1.45 w differential input impedance z in 80 100 120 w 1, fig. 7, 11 fault assert time t off 200 250 s fig. 13 reset assert time t off 57.5sfig. 14 reset de-assert time t on 55 100 ms fig. 14 transmit enable (tx_en) assert time t on 55 100 ms fig. 15 transmit enable (tx_en) de-assert time t off 5 7.5 s 2, fig. 15 transmit disable (tx_dis) assert time t off 57.5sfig. 15 transmit disable (tx_dis) de-assert time t on 55 100 ms fig. 15 power on initiation time t int 60 100 ms fig. 12 control i/os | input current high | |i ih | 0.5 ma (2.0 v < v ih < v cc ) (tx_en, tx_dis | input current lo w| |i il | 0.5 ma (v ee < v il < 0.8 v) fault, reset) output voltage low v ol v ee 0.4 v (i ol = 4.0 ma) lvttl & lvcmos output voltage high v oh 2.5 3.3 v cc v(i oh = ?0.5 ma) compatible notes: 1. differential impedance is measured between d in+ and d in? over the range 4 mhz to 2 ghz. 2. when the control signal transmitter enable, tx_en, is used to disable the transmitter, tx_en must be taken to a logic low-sta te level (vil) for one millisecond or longer. similarly, if the control signal transmitter disable, tx_dis, is used, then tx_dis must be taken to a lo gic high- state level (vih) for one millisecond or longer.
7 receiver electrical characteristics (t c = 0 c to +80 c, v cc = 3.3 v 5%, typical t c = +40 c, v cc = 3.3 v) notes: 1. i cc r is the dc supply current, dependent upon the number of active channels, where the data outputs are ac coupled with capacitors between the outputs and any resistive terminations. see figure 7 for recommended termination. 2. measured over the range 4 mhz to 2 ghz. 3. d v doutp-p = d v douth ? d v doutl , where d v douth = high state differential data output voltage and d v doutl = low state differential data output voltage. d v douth and d v doutl = v dout+ ? v dout? , measured with a 100 w differential load connected with the recommended coupling capacitors and with a 2500 mbd, 8b10b serial encoded data pattern. 4. inter-channel skew is defined for the condition of equal amplitude, zero ps skew input signals. input power at ?10 dbm. 5. rise and fall times are measured between the 20% and 80% levels using a 500 mhz square wave signal. 6. the signal detect output will change from logic ?0? (low) to ?1? (high) within the specified assert time for a step transitio n in optical input power from the de-asserted condition to the specified asserted optical power level on all 12 channels. 7. the signal detect output will change from logic ?1? (high) to ?0? (low) within the specified de-assert time for a step transi tion in optical input power from the specified asserted optical power level to the de-asserted condition on any 1 channel. parameter symbol min. typ. max. unit reference (conditions) supply current i ccr 400 445 ma 1, fig. 5 power dissipation p disr 1.3 1.55 w differential output impedance z out 80 100 120 w 2, fig. 8, 10 data output differential peak-to-peak voltage swing d v doutp-p 450 600 750 mv p-p 3, figs. 7, 8 inter-channel skew 100 150 ps 4 differential data output rise/fall time t r /t f 110 150 ps 5 signal detect assert time (off-to-on) de-assert time (on-to-off) t sda t sdd 170 190 s s 6 7 control i/o output voltage low lvttl & lvcmos output voltage high compatible v ol v oh v ee 2.5 3.1 0.4 v cc v v (i ol = 4.0 ma) (i oh = -0.5 ma)
8 optical characteristics transmitter optical characteristics (t c = 0 c to +80 c, v cc = 3.3 v 5%, typical t c = +40 c, v cc = 3.3 v) parameter symbol min. typ. max. unit reference output optical power 62.5/125 m fiber, na = 0.2 p out ?8 ?4 ?2 dbm avg. 1 output optical power ? off state p out dis ?30 dbm avg. extinction ratio output power -2 to -8 dbm er 6 7 db 2 center wavelength l c 830 850 860 nm spectral width ? rms s 0.4 0.85 nm rms rise/fall time t r /t f 50 100 ps 3 inter-channel skew 110 200 ps 4 relative intensity noise rin ?124 db/hz jitter contribution deterministic total dj tj 20 60 60 120 ps p-p ps p-p 5 6 notes: 1. the specified optical output power, measured at the output of a short test cable, will be compliant with iec 60825-1 amendmen t 2, class 1 accessible emission limits, ael, and the output power of the module without an attached cable will be compliant with the iec 60 825-1 amendment 2, class 1m ael. see discussion in the regulatory compliance section. 2. extinction ratio is defined as the ratio of the average output optical power of the transmitter in the high (?1?) state to th e low (?0?) state and is expressed in decibels (db) by the relationship 10log(phigh avg/plow avg). the transmitter is driven with a 550 mbaud, 2 7 -1 prbs serial encoded pattern. 3. these are unfiltered 20-80% value measured with optical-electrical converter with 12 ghz bandwidth. to increase accuracy of m easurement owning to laser overshoot and ringing, a filtered rise/fall time measurement is adopted with a 2.5gbps (1.875 ghz bandwidth) 4t h bessel thompson filter. a max spec of 100 ps for unfiltered waveform is equivalent to a max spec 215 ps for filtered waveform. 4. inter-channel skew is defined for the condition of equal amplitude, zero ps skew input signals. 5. deterministic jitter (dj) is defined as the combination of duty cycle distortion (pulse-width distortion) and data dependent jitter. deterministic jitter is measured at the 50% signal threshold level using a 2.5 gbd pseudo random bit sequence of length 2 23 ? 1 (prbs), or equivalent, test pattern with zero skew between the differential data input signals. 6. total jitter (tj) includes deterministic jitter and random jitter (rj). total jitter is specified at a ber of 10 -12 for the same 2.5 gbd test pattern as for dj.
9 receiver optical characteristics (t c = 0 c to +80 c, v cc = 3.3 v 5%, typical t c = +40 c, v cc = 3.3 v) parameter symbol min. typ. max. unit reference input optical power sensitivity p in min ?18.5 -16 dbm avg. 1 input optical power saturation p in max ?2 ?1 dbm avg. 2 operating center wavelength l c 830 860 nm stressed receiver sensitivity ?15.5 -11.3 dbm 3 stressed receiver eye opening 120 190 ps 4 return loss 12 19 db 5 signal detect asserted de-asserted hysteresis p a p d p a -p d -31 0.5 -19 -21 2 -17 dbm avg. dbm avg. db 6 notes: 1. sensitivity is defined as the average input power with the worst case, minimum, extinction ratio necessary to produce a ber o f 10 -12 at the center of the baud interval using a 2.5 gbd pseudo random bit sequence of length 2 23 ? 1 (prbs), or equivalent, test pattern. for this parameter, input power is equivalent to that provided by an ideal source, i.e., a source with rin and switching attributes that do not degrade t he sensitivity measurement. all channels not under test are operating receiving data with an average input power up to 6 db above p in min . 2. saturation is defined as the average input power that produces at the center of the output swing a receiver output eye width less than 120 ps where ber < 10 -12 using a 2.5 gbd pseudo random bit sequence of length 2 23 ?1 (prbs), or equivalent, test pattern. 3. stressed receiver sensitivity is defined as the average input power necessary to produce a ber < 10 -12 at the center of the baud interval using a 2.5 gbd pseudo random bit sequence of length 2 23 ? 1 (prbs), or equivalent, test pattern. for this parameter, input power is conditioned with 2.5 db inter-symbol interference, isi, (min), 33 ps duty cycle dependent deterministic jitter, dcd dj (min) and 6 db er (er penalty = 2.23 db). all channels not under test are operating receiving data with an average input power up to 6 db above p in min . 4. stressed receiver eye opening is defined as the receiver output eye width where ber < 10 -12 at the center of the output swing using a 2.5 gbd pseudo random bit sequence of length 2 23 ? 1 (prbs), or equivalent, test pattern. for this parameter, input power is an average input optical power of ?10.7 dbm and conditioned with 2.5 db isi (min), 33 ps dcd dj (min), 6 db er (er penalty = 2.23 db). all channels not under test are operating receiving data with an average input power up to 6 db above p in min . 5. return loss is defined as the ratio, in db, of the received optical power to the optical power reflected back down the fiber. 6. signal detect assertion requires all optical inputs to exhibit a minimum 6 db extinction ratio at p a = ?17 dbm. all channels not under test are operating with prbs 23 serial encoded patterns, asynchronous with the channel under test, and an average input power up to 6 db higher than p in min.
10 regulatory compliance table feature test method performance electrostatic discharge (esd) to the electrical pads jedec human body model (hbm) (jesd22-a114-b) jedec machine model (mm) transmitter module > 1000 v receiver module > 2000 v transmitter module > 50 v receiver module > 200 v electrostatic discharge (esd) to the connector receptacle variation of iec 61000-4-2 typically withstands at leasr 6 kv air discharge (with module biased) without damage. electromagnetic interference (emi) fcc part 15 cenelec en55022 (cispr 22a) vcci class 1 typically pass with 10 db margin. actual performance dependent on enclosure design. immunity variation of iec 61000-4-3 typically minimal effect from a 10 v/m field swept from 80 mhz to 1 ghz applied to the module without a chassis enclosure. laser eye safety and equipment type testing iec 60825-1 amendment 2 cfr 21 section 1040 p out : iec ael & us fda crdh class 1m cdrh accession number: 9720151-22 tuv certficate number: e2171095.04 component recognition underwriters laboratories and canadian standards association joint component recognition for information technology equipment including electrical business equipment ul file number: e173874
11 table 1. transmitter module pad description table 2. receiver module pad description symbol functional description v ee transmitter signal common. all voltages are referenced to this potential unless otherwise indicated. directly connect these pads to transmitter signal ground plane. v cc t transmitter power supply. use recommended power supply filter circuit in figure 6. din0+ through din11+ transmitter data in+ for channels 0 through 11, respectively. differential termination and self bias are i ncluded, see figure 11. din0? through din11? transmitter data in- for channels 0 through 11, respectively. differential termination and self bias are i ncluded; see figure 11. tx_en tx enable. active high. internal pull-up high = vcsel array is enabled if tx_dis is inactive (low). low = vcsel array is off. tx_en must be taken to a logic low state level (v ol ) for 1 ms or longer. tx_dis tx disable. active high. internal pull-down low = vcsel array is enabled if tx_en is active (high). high = vcsel array is off. tx_dis must be taken to a logic high state level (v oh ) for 1 ms or longer. reset- transmitter reset- input. active low. internal pull-up. low = resets logic functions, clears fault- signal, vcsel array is off. high = normal operation. see figure 14. fault- transmitter fault- output. active low. low (logic "0") results from a vcsel over-current condition, out of temperature range, or eeprom calibration data corruption condition detected for any vcsel. an asserted (logic "0") fault- disables the vcsel array and is cleared by reset- or power cycling v cc t fault- is a single ended lvttl compatible output. dnc do not connect to any electrical potential. symbol functional description v ee receiver signal common. all voltages are referenced to this potential unless otherwise indicated. directly connect these pads to receiver signal ground plane. v cc r receiver power supply. use recommended power supply filter circuit in figure 5. v pp not required for agilent product. pads not internally connected. (voltage for msa compatibility in order to ac- couple receiver data outputs). dout0+ through dout11+ receiver data out+ for channels 0 through 11, respectively. terminate these high-speed differential cml outputs with standard cml techniques at the inputs of the receiv ing device. individual data outputs will be squelched for insufficient input signal level. dout0? through dout11? receiver data out- for channel 0 through 11, respectively. terminate these high-speed differential cml o utputs with standard cml techniques at the inputs of the receiv ing device. individual data outputs will be squelched for insufficient input signal level. sd signal detect. normal optical input levels to all channels results in a logic "1" output, v oh , asserted. low input optical levels to any channel results in a fault condition indicated by a logic "0" output, v ol , de-asserted. sd is a single-ended lvttl compatible output. rx_en receiver output enable. active high (logic "1"), internal pull-up. low (logic "0") = receiver outputs disabled, all outputs are high (logic "1"). sq_en squelch enable input. active high (logic "1"), internal pull-up. low (logic "0") = squelch disabled. when sq_en is high and sd is low, corresponding outputs are squelched. en_sd enable signal detect. active high (logic "1"), internal pull-up. low (logic "0") = signal detect output forced active high. dnc do not connect to any electrical potential.
12 dnc j dnc i dnc h v ee g v ee f v ee e v ee d v ee c v ee b dnc a 1 dnc dnc dnc v ee v ee din5+ v ee v ee din8+ v ee 2 dnc v cct v cct v ee din4+ din5- v ee din7+ din8- v ee 3 dnc v cct v cct din3+ din4- v ee din6+ din7- v ee dnc 4 dnc v cct v cct din3- v ee din2+ din6- v ee din9- v ee 5 dnc v cct v cct v ee din1+ din2- v ee din10- din9+ v ee 6 dnc dnc dnc din0+ din1- v ee din11- din10+ v ee dnc 7 dnc reset- fault- din0- v ee v ee din11+ v ee v ee dnc 8 dnc tx_en tx_dis v ee v ee v ee v ee v ee v ee dnc 9 dnc dnc dnc dnc dnc dnc dnc dnc dnc dnc 10 transmitter module pad assignment (toward mtp? connector) top view (pcb layout) (10 x 10 array)
13 v pp j dnc i dnc h v ee g v ee f v ee e v ee d v ee c v ee b dnc a 1 v pp dnc dnc v ee v ee dout5- v ee v ee dout8- v ee 2 dnc v ccr v ccr v ee dout4- dout5+ v ee dout7- dout8+ v ee 3 dnc v ccr v ccr dout3- dout4+ v ee dout6- dout7+ v ee dnc 4 dnc v ccr v ccr dout3+ v ee dout2- dout6+ v ee dout9+ v ee 5 dnc v ccr v ccr v ee dout1- dout2+ v ee dout10+ dout9- v ee 6 dnc dnc sd dout0- dout1+ v ee dout11+ dout10- v ee dnc 7 v pp dnc dnc dout0+ v ee v ee dout11- v ee v ee dnc 8 v pp rx_en en_sd v ee v ee v ee v ee v ee v ee dnc 9 sq_en dnc dnc dnc dnc dnc dnc dnc dnc dnc 10 receiver module pad assignment (toward mtp? connector) top view (pcb layout) (10 x 10 array)
14 figure 3. case temperature measurement. point for taking module temperature bar code part num ber agilent ambient air temperature (?c) 0 30 air speed (m/sec) 2.0 50 45 0.5 1.0 60 2.5 35 40 55 65 80 1.5 heatsink case temp @ 80?c heatsink case temp @ 70?c 70 75 ambient air temperature vs. air speed w/1.5 watts transmitter worst case figure 4. ambient air temperature and air flow for t c = +80 c and t c = +70 c.
15 figure 5. recommended receiver power supply filter. v cc HFBR-789B v ccr v ccr v ccr v ccr v ccr v ccr r = 100 ? 0603 c = 10 f 1210 l = 1 h 2220 l = 6.8 nh 0805 r = 1.0 k ? 0603 c = 0.1 f 0603 c = 0.1 f 0603 c = 10 f 1210 v ccr v ccr note: 1. v cc is defined by 3.135 < v cc < 3.465 volts and the power suppl y filter has < 50 mv drop across it resul ting in 3.085 < v ccr < 3.415 volts. figure 6. recommended transmitter power supply filter. v cc hfbr-779b r = 100 ? 0603 c = 10 f 1210 l = 1 h 2220 l = 6.8 nh 0805 r = 1.0 k ? 0603 c = 0.1 f 0603 c = 0.1 f 0603 c = 10 f 1210 note: v cc is defined by 3.135 < v cc < 3.465 volts and the power supply filter has <50 mv drop across it resul ting in 3.085 < v cct < 3.415 volts. v cct v cct v cct v cct v cct v cct v cct v cct
16 figure 7. recommended ac coupling and data signal termination. figure 8. differential signals. note: ac coupling capacitors should be used to connect data outputs to data inputs between the hfbr-779b, HFBR-789B, and host board ics (e.g., asic) with either 50 ? single-ended or 100 ? differential terminations as shown. the capacitors' values can be reduced from 100 nf (0603 size) if the data rate and run length are limited. data out (+) hfbr-779b r 50 ? data out (?) r 50 ? r 100 ? asic HFBR-789B rdl 100 ? d out (+) d out (?) c = 100 nf c = 100 nf c = 100 nf c = 100 nf unused receiver channel outputs must be terminated. d in+ d in? transmitter ? v din ? + d out+ d out? receiver ? + ? v dout ? v di/oh ? v di/ol v di/o+ v di/o? ? v di/o p-p ? v di/ol ? + ? v di/oh v di/o refers to either v din or v dout as appropriate
17 figure 9. package board footprint (dimensions in mm). pcb top view. 2 x ? 2.54 min. p ad keep-out 18.42 min. 13.72 50 keep-out area for mpo connector 5.46 30.23 1.89 ref. 8.00 9 x 1.27 tot = 11.43 8.95 ref. front sym. 9 x 1.27 tot = 11.43 18 ref. sym. end of module 2 x ? 1.7 0.05 holes 3 x ? 4.17 min. p ad keep-out 3 x ? 2.69 0.05 holes for #2 screw (10 x 10 =) 100 x ? 0.58 0.05 pads pcb layout (top view) 100 pin fci meg-array? plug connect ors rx tx ? 0.1 a b-c ? 0.1 a b-c ? 0.1 a b-c ? 0.1 a b-c b a c ? 0.05 a b-c
18 figure 10. rx data output equivalent circuit. figure 12. typical transmitter power-up sequence. figure 13. transmitter fault signal timing diagram. figure 11. tx data input equivalent circuit. v ccr 50 ? 50 ? v ee d out+ d out? d in+ 50 ? d in? 50 ? z in v bias (nominal 1.7 v) v cct v ee v cc tx out 0 tx out 1 tx out 2 tx out 11 ~6.5 ms ~60 ms v cc > 2.8 v shutdown shutdown shutdown shutdown normal normal normal normal ~4.6 ms ~4.6 ms -fault ~100 ns ~toff <200 s tx out ch 0-11 no fault detected fault detected
19 figure 14. transmitter reset timing diagram. figure 15. transmitter tx_en and tx_dis timing diagram. tx out 0 tx out 1 tx out 2 tx out 11 ~4.2 ms (ton) ~55 ms shutdown normal ~4.6 ms ~4.6 ms > 100 ns ~5 s (toff) fault reset tx out ch 0 tx out ch 1 tx out ch 11 ~4.2 ms (ton) ~55 ms ~4.6 ms tx_en ~5 s (toff) shutdown normal tx out ch 0-11 (a) tx_dis ~5 s (toff) shutdown normal tx out ch 0-11 (b) tx_en [1] note [1]: tx_dis, which is not shown, is the functional compliment of tx_en. (c)
20 module outline figure 16. package outline for hfbr-779b and HFBR-789B (dimensions in mm). (9 x 1.27 =) 11.43 13.72 8.00 5.46 30.23 2x ? 1.1 3 x 2-56 unc x 3.8 mm deep (min.) 1.89 ref. ch 11 ch 0 17.50 14.34 12.90 16.00 ref. 41.07 ref. 8.90 6.95 1.00 17.60 top view front view channel numbers side view back view bottom view transmitter module bottom view receiver module 3 x 2-56 unc x 3.8 mm deep (min.) 30.23 (9 x 1.27 =) 11.43 2x ? 1.1 13.72 notes: 1. module supplied with port process plug. 2. module mass approximately 20 grams. 8.63 optical reference plane bar code part number agilent bar code part n um ber agilent
21 figure 17. package outline for hfbr-779be and HFBR-789Be (dimensions in mm)
figure 18. host frontplate layout (dimensions in mm) 19.02 min 0.50 max 13.40 0.2 3.60 0.2 15.70 0.25 35.31 0.75
www.agilent.com/ semiconductors for product information and a complete list of distributors, please go to our web site. for technical assistance call: americas/canada: +1 (800) 235-0312 or (916) 788-6763 europe: +49 (0) 6441 92460 china: 10800 650 0017 hong kong: (+65) 6756 2394 india, australia, new zealand: (+65) 6755 1939 japan: (+81 3) 3335-8152(domestic/inter- national), or 0120-61-1280(domestic only) korea: (+65) 6755 1989 singapore, malaysia, vietnam, thailand, philippines, indonesia: (+65) 6755 2044 taiwan: (+65) 6755 1843 data subject to change. copyright ? 2004 agilent technologies, inc. obsoletes: 5988-9996en july 26, 2004 5989-0953en

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